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Double side lapping/polishing machine

Model: JL-13B7

Hits: 108

Type: Special purpose machine tool

This machine is suitable for double side lapping and polishing of thin and fragile metal or non-metal parts such as silicon wafer, crystal quartz, optical crystal, glass, jewelry, lithium niobium acid, gallium arsenide, and ceramic wafer, etc.

 

PRINCIPLES OF EQUIPMENT:

The upper and lower grinding discs rotate in opposite directions.The movement of the workpiece is both revolutionary and self-rotating.Both sides are evenly grounded,the grinding resistance is small and does not damage the workpiece.

 

MAIN FEATURES:

·The main structure of the machine adopts a one-time forming process, and the reasonable structure greatly improves the rigidity of the machine.

·Set each relevant parameter directly through the touch screen.The LCD touch screen displays the current working state and related setting parameters in real time.The system provides 500 data storage.Menu-style operation is convenient and quick.

·Stepless variable frequency for speed-regulating, stable start&stop without impact. The upper and lower grinding discs are equipped with a fast rise and fall, a slow rise and a slow down function.Effectively reduce product scrap rate.

·Efficient and stable transmission system which with helical gear has low noise.

·Upper grinding disc automatically leveling,Effectively solve the wrong disk problem.The upper grinding disc has self-locking function,further improvement in safety performance.

·Reduce center gear diameter and increase processing area, Ring gear and sun gear speed is adjustable to realize carrier rotation direction changing.Save energy while improving production efficiency.

·The sun gear and the inner ring gear move synchronously,meeting the requirements of picking and placing workpieces and adjusting the meshing position of the carrier.

·Fully lubricated the opposite moving surfaces with a centralized lubrication system.

 

 

型号Model

单位Unit

设计值

研磨盘尺寸Plate size

mm

1053*530*45

最小研磨厚度Min.workpiece thickness

mm

0.4

游星轮片数量Number of carriers

7片(柱销式)

最大研磨直径Max. Workpiece diameter

mm

Φ280

下磨盘转速Lower plate rotational speed

rpm

2-45(无极调速)(Stepless change speed)

加工件精度Machined work piece precision

在来料平行度0.005以内时保证平行度0.005,表面粗糙度不

大于Ra0.15μm,抛光件Ra0.125μm

The parallelism is 0.005 when the parallelism of the

incoming material is 0.005, the surface roughness is not more than Ra0.15μm, the polishing piece Ra0.125μm

主电机Main motor power

380V/15Kw/1450rpm

下研磨盘跳动Lower plate run out

mm

0.05

修正轮修正平行度Correction wheel correction parallelism

mm

0.005

外形尺寸Overall dimension

mm

1800*1400*2680

机器重量Machine weight

Kg

3200

 

 

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