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Double side lapping/polishing machine

Model: JL-13B7

Hits: 108

Type: Special purpose machine tool

This machine is mainly used for grinding and polishing of thin brittle metal or non-metal such as silicon wafer, quartz wafer, optical crystal, glass, gem, lithium niobate, gallium arsenide, ceramic sheet, etc. Working PRINCIPLE: This SERIES of grinding machine is precision grinding equipment, the upper and lower grinding plates rotate in opposite directions, the workpiece in the carrier for both revolution and rotation of the star movement. The grinding resistance is small and does not damage the workpiece, and the grinding on both sides is uniform, and the production efficiency is high. Main features: · The main structure of the machine adopts a molding process, reasonable structure greatly rigid machine; · The man-machine interface is adopted to set relevant parameters directly through the touch screen, and the LCD touch screen displays the current working strength and related setting parameters in real time. The system provides 500 data storage, and the menu type is convenient and fast to grasp; · Control the frequency converter to drive the motor through the man-machine interface, start and stop are provided with buffer delay, stable operation and small impact, and the upper and lower grinding disc is provided with fast rise, fast fall, slow rise and slow fall function to effectively reduce the product scrapping rate; · Excellent transmission system designed with helical teeth runs stably and has low noise; · Automatic leveling of upper millstone, without human intervention, effectively solve the problem of wrong disc, and the upper millstone has self-locking function to further improve stability; · With unique design, the diameter of the middle gear is reduced, the processing area is increased, and the speed ratio is adjustable, the cruise ship can turn forward and reverse, saving energy and greatly improving production efficiency; · The sun wheel rises and falls synchronously with the inner gear ring to meet the requirements of taking and setting workpiece and adjusting the meshing position of the cruise ship; · Adopt centralized lubrication system to fully lubricate each relative moving surface.

型号Model

单位Unit

设计值

研磨盘尺寸Plate size

mm

1053*530*45

研磨厚度Min.workpiece thickness

mm

0.4

游星轮片数量Number of carriers

7片(柱销式)

研磨直径Max. Workpiece diameter

mm

Φ280

下磨盘转速Lower plate rotational speed

rpm

2-45(无极调速)(Stepless change speed)

加工件精度Machined work piece precision

在来料平行度0.005以内时保护平行度0.005,表面粗糙度不

大于Ra0.15μm,抛光件Ra0.125μm

The parallelism is 0.005 when the parallelism of the

incoming material is 0.005, the surface roughness is not more than Ra0.15μm, the polishing piece Ra0.125μm

主电机Main motor power

380V/15Kw/1450rpm

下研磨盘跳动Lower plate run out

mm

0.05

修正轮修正平行度Correction wheel correction parallelism

mm

0.005

外形尺寸Overall dimension

mm

1800*1400*2680

机器重量Machine weight

Kg

3200


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